The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Aug. 23, 2018
Applicant:

Hitachi High-tech Corporation, Minato-Ku, Tokyo, JP;

Inventors:

Takumi Tandou, Tokyo, JP;

Takamasa Ichino, Tokyo, JP;

Kenetsu Yokogawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01L 21/67069 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/6833 (2013.01); H01L 21/68742 (2013.01); H01L 21/68757 (2013.01); H01J 37/32229 (2013.01); H01J 2237/002 (2013.01); H01J 2237/18 (2013.01); H01L 21/6831 (2013.01);
Abstract

A plasma processing apparatus including: a processing chamber; a sample stage; a vacuum exhaust unit; and a plasma generation unit, the sample stage includes: a first metallic base material having a refrigerant flow path formed therein; a second metallic base material disposed above the first metallic base material and has a lower thermal conductivity than the first metallic base material; and a plurality of lift pins vertically moving the object to be processed with respect to the sample stage. A plurality of through-holes through which the plurality of the lift pins passes is formed in the first and the second metallic base material, and a boss, which electrically insulates the lift pin from the first and the second metallic base material and is formed using an insulating member having a higher thermal conductivity than the second metallic base material, is inserted into each of the plurality of through-holes.


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