Takeshi Sadohara

Title: Innovations by Takeshi Sadohara

Introduction

Takeshi Sadohara is a notable inventor based in Ayase, Japan. He has made significant contributions to the field of wafer processing technology, holding two patents that enhance the efficiency and quality of wafer production.

Latest Patents

Sadohara's latest patents include a wafer flattening system and a wafer flattening process. The wafer flattening system is designed to automatically remove the natural oxide film from a wafer while flattening and smoothing its surface. This innovation improves the surface roughness of the wafer and enhances work efficiency. The process involves immersing the wafer in an aqueous solution of hydrofluoric acid to remove the oxide film, followed by local etching using activated species gas produced from SF gas. The final step includes giving a mirror finish to the wafer surface using a CMP apparatus. Additionally, the wafer flattening process focuses on improving micro-roughness through local etching while maintaining a specific distance between the plasma discharge location and the wafer surface. This careful control allows for effective etching without damaging the wafer.

Career Highlights

Throughout his career, Sadohara has worked with various companies, including Speedfam-Ipec Co. Ltd. His work has significantly impacted the semiconductor industry, particularly in wafer processing technologies.

Collaborations

Sadohara has collaborated with notable individuals in his field, including Michihiko Yanagisawa and Chikai Tanaka. Their combined expertise has contributed to advancements in wafer technology.

Conclusion

Takeshi Sadohara's innovations in wafer processing demonstrate his commitment to improving semiconductor manufacturing. His patents reflect a deep understanding of the technical challenges in the industry and provide solutions that enhance efficiency and quality.