Fukuoka, Japan

Takeshi Ogawa

This inventor holds 2 USPTO granted patents. Top assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Corporation. Active years: 2004-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takeshi Ogawa. Retrieved from https://idiyas.com/inventor/takeshi-ogawa-710xbqc9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2004-2025

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2 patents (USPTO):Explore Patents

Title: **Takeshi Ogawa: Innovator in Semiconductor Technology**

Introduction

Takeshi Ogawa is a prominent inventor based in Fukuoka, Japan, recognized for his significant contributions to the field of semiconductor technology. With a total of two patents to his name, Ogawa has demonstrated a strong commitment to innovation and problem-solving within the industry.

Latest Patents

Ogawa's latest patents include a **Semiconductor Device** and an **Inverter Device**. The semiconductor device addresses the issue of yield reduction by implementing a design that prevents adhesive leakage within the semiconductor structure. This innovative design comprises a heat sink, a wiring board situated on the heat sink, and a semiconductor chip placed atop the wiring board. The unique case housing surrounds both the wiring board and the semiconductor chip, while the adhesive forms a joint between the housing and the heat sink. The addition of a sealing material fully encapsulates the components, ensuring integrity. A notable feature is the convex portion on the joint area, which separates the adhesive from the sealing material, effectively enhancing the device's reliability.

The **Power Semiconductor Device** patent outlines a novel design with a polygonal nut that receives a clamping bolt. This nut is securely inserted into a designated hole within a resin case, and a round-shaped notch is strategically formed to prevent contact with the corner portion of the polygonal nut. This innovative approach effectively mitigates the risk of cracking in the resin case, thereby ensuring durability and performance.

Career Highlights

Throughout his career, Takeshi Ogawa has worked with renowned companies, including Mitsubishi Denki Kabushiki Kaisha and Mitsubishi Electric Corporation. His experiences at these firms have significantly shaped his technical expertise and understanding of semiconductor device design and manufacturing.

Collaborations

Ogawa has collaborated with notable professionals in his field, including Yosuke Miyagi and Hideki Tsukamoto. Their collective expertise and innovative outlook have contributed to the development of groundbreaking technologies in semiconductor devices.

Conclusion

Takeshi Ogawa stands out as an influential inventor in the semiconductor industry. His dedication to innovation is evident in his patents, which address critical challenges in device performance and reliability. As technology continues to advance, Ogawa's work will undoubtedly leave a lasting impact on the realm of semiconductor technologies, pushing the boundaries of what's possible in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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