Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Takeshi Ogawa

Korehide Okamoto

Seiji Saiki

Hideki Tsukamoto

Takuro Mori

Masaru Furukawa

Takamasa Oda

Yosuke Miyagi

Provided are a semiconductor device and an inverter device with a decrease in yield being suppressed by preventing the adhesive from leaking into the inside of the semiconductor device. A heat sink, a wiring board provided on the heat sink, a semiconductor chip provided on the wiring board, a case housing provided on the heat sink so as to surround the wiring board and the semiconductor chip, an adhesive that adheres a lower surface joint portion of the case housing and an upper surface joint portion of the heat sink, a sealing material that fills the case housing and covers the wiring board and the semiconductor chip, and a convex portion provided on the lower surface joint portion of the case housing or the upper surface joint portion of the heat sink, that separates the adhesive from the sealing material are included.

Semiconductor device and inverter device

A polygonal nut for receiving a clamping bolt is securely inserted in a nut insertion hole which is formed in the thin portion of the resin case , and the polygonal nut is engaged with an inner surface of the nut insertion hole . The inner surface of the nut insertion hole has a round-shaped notch concave portion formed at a position confronting to a corresponding corner portion of the polygonal nut so that the corner portion of the polygonal nut is not in contact with a resin case member to thereby prevent the resin case from being cracked.

Power semiconductor device

Growing community of inventors

Fukuoka, Japan

Takeshi Ogawa