The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Apr. 12, 2022
Mitsubishi Electric Corporation, Tokyo, JP;
Yosuke Miyagi, Fukuoka, JP;
Hideki Tsukamoto, Fukuoka, JP;
Takuro Mori, Fukuoka, JP;
Masaru Furukawa, Fukuoka, JP;
Korehide Okamoto, Fukuoka, JP;
Takamasa Oda, Fukuoka, JP;
Seiji Saiki, Fukuoka, JP;
Takeshi Ogawa, Fukuoka, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided are a semiconductor device and an inverter device with a decrease in yield being suppressed by preventing the adhesive from leaking into the inside of the semiconductor device. A heat sink, a wiring board provided on the heat sink, a semiconductor chip provided on the wiring board, a case housing provided on the heat sink so as to surround the wiring board and the semiconductor chip, an adhesive that adheres a lower surface joint portion of the case housing and an upper surface joint portion of the heat sink, a sealing material that fills the case housing and covers the wiring board and the semiconductor chip, and a convex portion provided on the lower surface joint portion of the case housing or the upper surface joint portion of the heat sink, that separates the adhesive from the sealing material are included.