Kanagawa, Japan

Takeshi Endoh

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 5.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015-2025

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Takeshi Endoh

Introduction

Takeshi Endoh is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of thermal management through his innovative designs and patents. With a total of 4 patents, Endoh has established himself as a key figure in the development of advanced cooling systems.

Latest Patents

Endoh's latest patents include groundbreaking technologies such as a loop heat pipe, cooling system, electronic equipment, and wick. One of his notable inventions is a loop heat pipe that features an evaporator, a condenser, and a vapor line that facilitates the flow of a vapor-phase working fluid. This design also incorporates a liquid line for the liquid-phase working fluid and a wick that is both elastic and compressed within the evaporator. The innovative structure allows for efficient heat transfer and management. Another significant patent involves a cooling device that utilizes an elastic wick to enhance contact pressure against the inner wall of the evaporator, thereby improving the overall efficiency of the cooling system.

Career Highlights

Takeshi Endoh is currently employed at Ricoh Company, Ltd., where he continues to push the boundaries of thermal management technology. His work has been instrumental in developing solutions that cater to the growing demands of electronic devices and systems.

Collaborations

Endoh has collaborated with notable colleagues such as Tomoyasu Hirasawa and Kiyotada Katoh. Their combined expertise has contributed to the successful development of innovative technologies in the field.

Conclusion

Takeshi Endoh's contributions to the field of thermal management through his patents and collaborative efforts highlight his role as a leading inventor. His work continues to influence the design and efficiency of cooling systems in electronic devices.

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