The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Mar. 03, 2022
Applicants:

Takeshi Endoh, Kanagawa, JP;

Tomoyasu Hirasawa, Kanagawa, JP;

Inventors:

Takeshi Endoh, Kanagawa, JP;

Tomoyasu Hirasawa, Kanagawa, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01);
Abstract

Disclosed is a loop heat pipe having an evaporator, a condenser, a vapor line connected between the evaporator and the condenser through which a vapor-phase working fluid flows, a liquid line connected between the condenser and the evaporator through which a liquid-phase working fluid flows, and a wick having an elasticity and provided inside the evaporator in a compressed and deformed state. The liquid-phase working fluid permeates into the wick, and a boundary between the liquid phase working fluid and the vapor phase working fluid is formed in the wick. A stress generated in the wick due to compressive deformation is greater than a pressure loss that occurs during circulation of the working fluid from the vapor-phase side of the boundary via the condenser back to the liquid-phase side of the boundary.


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