The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Mar. 20, 2023
Tohru Yashiro, Kanagawa, JP;
Shinji Matsumoto, Kanagawa, JP;
Takeshi Endoh, Kanagawa, JP;
Yuko Komai, Kanagawa, JP;
Hiroshi Kondo, Kanagawa, JP;
Hiroyuki Takahashi, Kanagawa, JP;
Muneaki Iwata, Kanagawa, JP;
Tohru Hasegawa, Kanagawa, JP;
Ryuya Mashiko, Tokyo, JP;
Shinichi Hatanaka, Tokyo, JP;
Hiroyuki Hiratsuka, Kanagawa, JP;
Tohru Yashiro, Kanagawa, JP;
Shinji Matsumoto, Kanagawa, JP;
Takeshi Endoh, Kanagawa, JP;
Yuko Komai, Kanagawa, JP;
Hiroshi Kondo, Kanagawa, JP;
Hiroyuki Takahashi, Kanagawa, JP;
Muneaki Iwata, Kanagawa, JP;
Tohru Hasegawa, Kanagawa, JP;
Ryuya Mashiko, Tokyo, JP;
Shinichi Hatanaka, Tokyo, JP;
Hiroyuki Hiratsuka, Kanagawa, JP;
RICOH COMPANY, LTD., Tokyo, JP;
Abstract
A member includes a base material and a conductive layer. The conductive layer conducts heat or electricity. The conductive layer includes a conductive portion and a non-conductive portion. The conductive portion conducts heat or electricity. The conductive portion is disposed on at least one of an upper surface or a lower surface of the non-conductive portion and on a side surface of the non-conductive portion.