This inventor holds 2 USPTO granted patents. Top assignee: Tokyo Seimitsu Co., Ltd.. Active years: 2021-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021-2026
Title: Takashi Tamogami: Innovator in Wafer Processing Technology
Introduction
Takashi Tamogami is a notable inventor based in Hachioji, Japan. He has made significant contributions to the field of wafer processing technology. His innovative methods aim to enhance the efficiency and quality of chip production.
Latest Patents
Tamogami holds a patent for a method of processing wafers. This patent, titled "Method for Processing Wafer," simplifies the wafer processing process and efficiently obtains chips of stable quality. The method includes several steps: attaching a back grinding tape to the front surface of a wafer, applying a laser beam from the back surface along a cut line to form modified regions, processing the back surface to reduce the wafer's thickness, and finally applying a load to divide the wafer along the cut line while the back grinding tape is still attached.
Career Highlights
Tamogami is currently employed at Tokyo Seimitsu Co., Ltd., where he continues to develop and refine wafer processing technologies. His work has been instrumental in advancing the capabilities of semiconductor manufacturing.
Collaborations
He collaborates with talented coworkers, including Syuhei Oshida and Ryosuke Kataoka, who contribute to the innovative environment at Tokyo Seimitsu Co., Ltd.
Conclusion
Takashi Tamogami's contributions to wafer processing technology exemplify the spirit of innovation in the semiconductor industry. His patented methods are paving the way for more efficient and high-quality chip production.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile