The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jan. 08, 2024
Tokyo Seimitsu Co., Ltd., Hachioji, JP;
Takashi Tamogami, Hachioji, JP;
TOKYO SEIMITSU CO., LTD., Tokyo, JP;
Abstract
A dicing apparatus that performs dicing of a street of a workpiece attached to a dicing tape via a die attach film and cuts the workpiece and the die attach film along the street includes a cross-sectional profile acquisition unit that acquires a cross-sectional profile of a machined groove formed through the dicing, a cut amount detection unit that detects a cut amount into the die attach film obtained through the dicing on the basis of the cross-sectional profile acquired by the cross-sectional profile acquisition unit, and a division determination unit that determines whether or not the die attach film is in an undivided state on the basis of the cut amount detected by the cut amount detection unit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile