Hiratsuka, Japan

Takashi Kousaka



Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2012-2014

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4 patents (USPTO):Explore Patents

Title: Takashi Kousaka: Innovator in Epoxy Resin Technology

Introduction

Takashi Kousaka is a prominent inventor based in Hiratsuka, Japan. He has made significant contributions to the field of epoxy resin compositions, particularly for fiber-reinforced composite materials. With a total of 4 patents to his name, Kousaka's work is recognized for its innovative approaches to enhancing material properties.

Latest Patents

Kousaka's latest patents include an epoxy resin composition designed for fiber-reinforced composite materials. This invention provides an epoxy resin composition that comprises an epoxy resin (A) with a specific molecular weight range, a thermoplastic resin (B), and a curing agent (C). The resulting cured composition exhibits a co-continuous phase of the epoxy resin and thermoplastic resin, leading to a product with high toughness. Another notable patent focuses on improving the tackiness stability of epoxy resin compositions during storage while maintaining mechanical characteristics. This composition is characterized by a specific ratio of amine curing agents and organic acid dihydrazide compounds.

Career Highlights

Kousaka is currently employed at The Yokohama Rubber Co., Ltd., where he continues to develop innovative materials. His expertise in epoxy resin technology has positioned him as a key figure in the advancement of composite materials.

Collaborations

Throughout his career, Kousaka has collaborated with notable coworkers such as Tomohiro Ito and Mitsuhiro Iwata. These collaborations have further enriched his research and development efforts in the field of epoxy resins.

Conclusion

Takashi Kousaka's contributions to epoxy resin technology demonstrate his commitment to innovation and material science. His patents reflect a deep understanding of composite materials, paving the way for advancements in various applications.

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