The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8153229 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 10, 2012

Filed:

Apr. 24, 2007
Applicants:

Takashi Kousaka, Hiratsuka, JP;

Mitsuhiro Iwata, Hiratsuka, JP;

Tomohiro Ito, Hiratsuka, JP;

Inventors:

Takashi Kousaka, Hiratsuka, JP;

Mitsuhiro Iwata, Hiratsuka, JP;

Tomohiro Ito, Hiratsuka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150° C., per 100 parts by weight of an epoxy resin (A).


Find Patent Forward Citations

Kousaka, Takashi. (2012). Epoxy resin composition for fiber-reinforced composite material (U.S. Patent No. 8153229). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8153229

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