The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Apr. 24, 2007
Takashi Kousaka, Hiratsuka, JP;
Tomohiro Ito, Hiratsuka, JP;
Mitsuhiro Iwata, Hiratsuka, JP;
Koichiro Miyoshi, Hiratsuka, JP;
Takashi Kousaka, Hiratsuka, JP;
Tomohiro Ito, Hiratsuka, JP;
Mitsuhiro Iwata, Hiratsuka, JP;
Koichiro Miyoshi, Hiratsuka, JP;
The Yokohama Rubber Co., Ltd., Tokyo, JP;
Abstract
Provided is an epoxy resin composition for fiber-reinforced composite materials, which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face sheet of a honeycomb panel. The epoxy resin composition, which comprises: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D), is characterized in that the epoxy resin composition after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases.