Nagano, Japan

Takashi Arai

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 2021-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Arai. Retrieved from https://idiyas.com/inventor/takashi-arai-8f1x2293

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 1.5

ph-index = 1


Company Filing History:


Years Active: 2021-2022

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2 patents (USPTO):Explore Patents

Title: The Innovative Mind of Takashi Arai

Introduction

Takashi Arai, hailing from Nagano, Japan, is an accomplished inventor known for his significant contributions to the field of semiconductor devices and wiring substrates. With a total of two patents to his name, Arai has demonstrated his profound understanding of materials and electrical engineering.

Latest Patents

Arai's latest patents focus on advanced wiring substrates and semiconductor devices. One patent describes a wiring substrate designed with a wiring layer and an insulation layer that covers it, featuring an opening that partially exposes the wiring layer. This innovative design includes a seed layer that continuously covers the wall surface of the opening and the upper surface of the insulation layer. The construction is further enhanced by a metal layer, a metal post, and an outer coating plating layer, where the side portion is notably thinner than the upper portion.

Another patent introduces a wiring substrate with first wiring portions and an insulation layer covering them. In this design, openings extend through the insulation layer, partially exposing the upper surfaces of the first wiring portions. Differentiated by capacity, each of the second wiring portions contains via wiring and a connection terminal on the upper surface of the insulation layer. The via wiring incorporates an electrolytic plated layer along with an electroless plating structure, which increases in thickness relative to the capacity of the openings filled.

Career Highlights

Takashi Arai is currently employed at Shinko Electric Industries Co., Ltd., a company renowned for its advancements in electronic components. His work at Shinko Electric has positioned him as a valuable asset in the development of cutting-edge solutions in the semiconductor arena.

Collaborations

Throughout his career, Arai has collaborated with talented individuals like Fumimasa Katagiri and Katsuya Fukase. Working alongside such esteemed colleagues has fostered innovation and creativity in the projects they undertake, ultimately enhancing the quality and impact of their collective work.

Conclusion

With a remarkable ability to innovate, Takashi Arai continues to make strides in the field of electrical engineering. His patents not only reflect his technical expertise but also contribute to the ongoing evolution of semiconductor technology. As he progresses in his career, Arai's future contributions are certainly one to watch for in the technological landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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