The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
May. 22, 2019
Shinko Electric Industries Co., Ltd., Nagano, JP;
Takashi Arai, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A wiring substrate includes a wiring layer and an insulation layer covering the wiring layer. The insulation layer includes an opening partially exposing the wiring layer. A seed layer continuously covers a wall surface of the opening and an upper surface of the insulation layer. The wiring substrate also includes a metal layer, a metal post, and an outer coating plating layer. The opening is filled with the seed layer and the metal layer formed on the seed layer. The metal post is formed on the metal layer and on the seed layer that is located on the insulation layer. The outer coating plating layer includes an upper portion, entirely covering an upper surface of the metal post, and a side portion, entirely covering a side surface of the metal post and exposing an outer end surface of the seed layer. The side portion is thinner than the upper portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile