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For the Inventor, By the Inventor

Nagano, Japan

Takahiro Iijima

USPTO Granted Patents = 18

Average Co-Inventor Count = 2.6

ph-index = 11

Forward Citations = 436(Granted Patents)


Company Filing History:

goldMedal18 out of 1,700 
 
Shinko Electric Industries Co., Ltd.
 patents

Years Active: 1992-2008

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18 patents (USPTO):Explore Patents
1. 7352060 - Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate (2008-04-01),
2. 7335531 - Semiconductor device package and method of production and semiconductor device of same (2008-02-26),
3. 7314780 - Semiconductor package, method of production of same, and semiconductor device (2008-01-01),
4. 7250355 - Multilayered circuit substrate, semiconductor device and method of producing same (2007-07-31),
5. 7033934 - Method of production of semiconductor package (2006-04-25),
6. 7019404 - Multilayered circuit substrate, semiconductor device and method of producing same (2006-03-28),
7. 6921977 - Semiconductor package, method of production of same, and semiconductor device (2005-07-26),
8. 6914322 - Semiconductor device package and method of production and semiconductor device of same (2005-07-05),
9. 6891732 - Multilayer circuit board and semiconductor device using the same (2005-05-10),
10. 6828669 - Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof (2004-12-07),
11. 6828224 - Method of fabricating substrate utilizing an electrophoretic deposition process (2004-12-07),
12. 6783652 - Process for manufacturing a wiring board (2004-08-31),
13. 6764931 - Semiconductor package, method of manufacturing the same, and semiconductor device (2004-07-20),
14. 6340841 - Build-up board package for semiconductor devices (2002-01-22),
15. 5909053 - Lead frame and method for manufacturing same (1999-06-01),
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