The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
May. 13, 2005
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
Applicants:
Noriyoshi Shimizu, Nagano, JP;
Tomoo Yamasaki, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Takahiro Iijima, Nagano, JP;
Inventors:
Noriyoshi Shimizu, Nagano, JP;
Tomoo Yamasaki, Nagano, JP;
Akio Rokugawa, Nagano, JP;
Takahiro Iijima, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler is fabricated by mixing a paraelectric filler with an inorganic filler having a high dielectric constant.