Company Filing History:
Years Active: 2009-2010
Title: Takaaki Anada: Innovator in Soldering Technology
Introduction
Takaaki Anada is a notable inventor based in Kakogawa, Japan. He has made significant contributions to the field of soldering technology, holding a total of 3 patents. His work focuses on improving the bonding strength of soldering processes, particularly in relation to electroless nickel plating.
Latest Patents
Anada's latest patents include innovative solutions such as a flux for soldering, a soldering method, and a printed circuit board. The first patent describes a flux for soldering that is specifically designed for boards subjected to electroless nickel plating. This flux contains resin with film-forming ability, activator, and solvent, along with metallic salt in an amount of 0.1 to 20% by weight of the total flux. This formulation effectively suppresses the diffusion of nickel solder in soldering portions and prevents the concentration of phosphorous, thereby enhancing the bonding strength of the soldering process.
The second patent details a flux that includes resin with film-forming ability, activator, solvent, and at least one complex selected from silver and copper complexes. This flux is utilized when soldering onto circuits that have electroless nickel plating or additional gold plating. The barrier layer of silver or copper that deposits on the surfaces of lands helps to suppress the diffusion of nickel into the melted solder alloy during soldering, which also prevents phosphorous concentration. This innovation significantly improves the bonding strength of soldering and minimizes the reduction deposition of silver and/or copper to areas outside the circuit patterns.
Career Highlights
Takaaki Anada is currently employed at Harima Chemicals, Incorporated, where he continues to develop and refine soldering technologies. His expertise in this area has positioned him as a key figure in the advancement of soldering methods.
Collaborations
Anada collaborates with talented coworkers such as Kazuki Ikeda and Hisao Irie, contributing to a dynamic team focused on innovation in soldering technology.
Conclusion
Takaaki Anada's contributions to soldering technology through his patents demonstrate his commitment to enhancing the efficiency and effectiveness of soldering processes. His work not only improves bonding strength but also addresses critical challenges in the industry.