The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2010

Filed:

Mar. 23, 2007
Applicants:

Kazuki Ikeda, Kakogawa, JP;

Hisao Irie, Kakogawa, JP;

Toshinori Shima, Kakogawa, JP;

Takaaki Anada, Kakogawa, JP;

Syunsuke Ishikawa, Kakogawa, JP;

Inventors:

Kazuki Ikeda, Kakogawa, JP;

Hisao Irie, Kakogawa, JP;

Toshinori Shima, Kakogawa, JP;

Takaaki Anada, Kakogawa, JP;

Syunsuke Ishikawa, Kakogawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 35/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.


Find Patent Forward Citations

Ikeda, Kazuki. (2010). Flux for soldering, soldering method, and printed circuit board (U.S. Patent No. 7798389). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7798389

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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