The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Jun. 22, 2007
Kazuki Ikeda, Kakogawa, JP;
Shunsuke Ishikawa, Kakogawa, JP;
Takaaki Anada, Kakogawa, JP;
Keigo Obata, Akashi, JP;
Takao Takeuchi, Akashi, JP;
Naoya Inoue, Akashi, JP;
Kazuki Ikeda, Kakogawa, JP;
Shunsuke Ishikawa, Kakogawa, JP;
Takaaki Anada, Kakogawa, JP;
Keigo Obata, Akashi, JP;
Takao Takeuchi, Akashi, JP;
Naoya Inoue, Akashi, JP;
Harima Chemicals, Inc., Hyogo, JP;
Abstract
A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.