The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Aug. 25, 2006
Eiichiro Matsubara, Kyoto, JP;
Tetsu Ichitsubo, Kyoto, JP;
Takaaki Anada, Kakogawa, JP;
Seishi Kumamoto, Kakogawa, JP;
Hisao Irie, Kakogawa, JP;
Eiichiro Matsubara, Kyoto, JP;
Tetsu Ichitsubo, Kyoto, JP;
Takaaki Anada, Kakogawa, JP;
Seishi Kumamoto, Kakogawa, JP;
Hisao Irie, Kakogawa, JP;
Harima Chemicals, Inc., Hyogo, JP;
Abstract
The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500° C., in particular, not less than 900° C. The raw material metal used as raw material of the solder powder comprises 3 to 12% by weight of Zn, 1.0 to 15% by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided.