This inventor holds 1 USPTO granted patent. Top assignee: Harima Chemicals, Incorporated. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Innovator Eiichiro Matsubara: Pioneering Solder Powder Manufacturing
Introduction: Eiichiro Matsubara, an esteemed inventor based in Kyoto, Japan, has made significant contributions to the field of materials engineering. With a focus on advanced soldering techniques, Matsubara has secured one patent, showcasing his innovative approach to manufacturing solder powders that enhance joint reliability.
Latest Patents: Matsubara's notable patent is titled "Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder." This invention revolves around a revolutionary method utilizing a liquid quenching atomizing technique. Key to this method is the atomizing temperature, which must be no less than 500°C, and ideally, at least 900°C. The composition of the solder powder includes a carefully calibrated blend of metals, consisting of 3 to 12% by weight of zinc (Zn), and a total of 1.0 to 15% by weight of copper (Cu) and nickel (Ni), complemented by tin (Sn) and inevitable impurities. This precise formulation contributes to the high joint strength and reliability of solder joints, making it a valuable advancement in the industry.
Career Highlights: As a member of Harima Chemicals Incorporated, Matsubara has had a formidable impact on the company's innovation initiatives. His work has not only promoted advancements in solder technology but has also enhanced the company's position in the competitive materials sector.
Collaborations: Throughout his career, Matsubara has collaborated with esteemed colleagues such as Tetsu Ichitsubo and Takaaki Anada, contributing to a collaborative environment that fosters innovation and excellence in research and development.
Conclusion: Eiichiro Matsubara stands as a testament to the spirit of innovation in the field of material science. His patented method for manufacturing SnZnNiCu solder powder represents a significant advance in solder technology, ensuring greater joint reliability in various applications. As industries continue to seek innovative solutions, Matsubara's contributions will remain influential in shaping the future of solder material development.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile