This inventor holds 1 USPTO granted patent and 11 published patent applications. Top assignee: Harima Chemicals, Incorporated. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Tetsu Ichitsubo: Innovator in Solder Powder Manufacturing
Introduction
Tetsu Ichitsubo is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of materials science, particularly in the development of solder powders. His innovative approach has led to advancements that enhance the reliability and strength of solder joints.
Latest Patents
Tetsu Ichitsubo holds a patent for the "Method of manufacturing the SnZnNiCu solder powder." This invention describes a process for producing solder powder through a liquid quenching atomizing method. The atomizing temperature is set at not less than 500°C, and ideally, not less than 900°C. The raw material for the solder powder consists of 3 to 12% by weight of zinc, along with 1.0 to 15% by weight of the combined copper and nickel, with tin and inevitable impurities making up the remainder. This method results in a solder powder that achieves high joint strength and improves the reliability of solder joints.
Career Highlights
Tetsu Ichitsubo is associated with Harima Chemicals, Incorporated, where he has been instrumental in research and development. His work has focused on creating materials that meet the demanding requirements of modern electronics.
Collaborations
Tetsu has collaborated with notable colleagues, including Takaaki Anada and Hisao Irie. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Tetsu Ichitsubo's innovative methods in solder powder manufacturing have made a significant impact on the industry. His contributions continue to enhance the performance and reliability of electronic components.