Uiwang, South Korea

Tai O Chung

This inventor holds 1 USPTO granted patent. Top assignee: Eo Technics Co., Ltd. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tai O Chung. Retrieved from https://idiyas.com/inventor/tai-o-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Tai O Chung

Introduction

Tai O Chung is a notable inventor based in Uiwang, South Korea. He has made significant contributions to the field of technology, particularly with his innovative approach to reducing warpage in workpieces. His work is characterized by a blend of creativity and technical expertise, which has led to the development of a unique patent.

Latest Patents

Tai O Chung holds a patent for a "Warpage reduction device and warpage reduction method." This device includes a jig with a warped shape that effectively distributes stress across a workpiece. It features a light source that heats the workpiece to flatten it, a pressurizer that applies pressure to the heated workpiece, a cooler that cools the deformed workpiece, and a controller that manages the operations of these components. This innovative solution addresses a common issue in manufacturing processes, showcasing Tai's ability to solve complex problems.

Career Highlights

Tai O Chung is currently employed at Eo Technics Co., Ltd., where he continues to develop and refine his inventions. His work at the company has allowed him to collaborate with talented individuals in the field, further enhancing his contributions to technology.

Collaborations

Some of Tai's coworkers include Dae Ho Jung and Gi Hong Seo. Their collaboration fosters a creative environment that encourages innovation and the development of new technologies.

Conclusion

Tai O Chung's inventive spirit and dedication to solving practical problems have made him a valuable asset in the field of technology. His patent for a warpage reduction device exemplifies his innovative approach and commitment to excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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