Kyungki-Do, South Korea

TaeWoo Lee

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2013-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: TaeWoo Lee. Retrieved from https://idiyas.com/inventor/taewoo-lee-8j9isru5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 88(Granted Patents)


Company Filing History:


Years Active: 2013-2015

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5 patents (USPTO):Explore Patents

Title: Innovations by TaeWoo Lee

Introduction

TaeWoo Lee is a prominent inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

One of TaeWoo Lee's latest patents is titled "Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV." This invention involves a semiconductor device that incorporates a TSV wafer and a semiconductor die mounted over it. A channel is formed through the TSV wafer, and an encapsulant is deposited over both the semiconductor die and TSV wafer. Conductive TMV are created through the encapsulant, connecting to the conductive TSV and contact pads of the semiconductor die. This innovative method allows for multiple semiconductor dies to be stacked over the TSV wafer, enhancing the device's functionality.

Another notable patent is "Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability." This invention features a substrate with a first conductive layer and an insulating layer that has an opening over the first conductive layer. A second conductive layer is formed within this opening, designed with non-linear surfaces to increase the contact area. This design improves the reliability of the joint connections in semiconductor devices.

Career Highlights

TaeWoo Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Throughout his career, TaeWoo Lee has collaborated with notable colleagues, including DaeSik Choi and Young Jin Woo. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

TaeWoo Lee's contributions to semiconductor technology through his innovative patents have significantly impacted the industry. His work continues to pave the way for advancements in semiconductor devices, showcasing his expertise and dedication to innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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