This inventor holds 3 USPTO granted patents. Top assignees: Hanwha Precision Machinery Co., Ltd., Hanwha Precision Machinery Co., Ltd.. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
2 out of 8 
1 out of 15 
Years Active: 2025-2026
Title: Tae Woo Kang - Innovator in Bonding Technology
Introduction
Tae Woo Kang is a notable inventor based in Changwon-si, South Korea. He has made significant contributions to the field of bonding technology, particularly through his innovative patent. His work is recognized for its potential to enhance manufacturing processes in various industries.
Latest Patents
Tae Woo Kang holds a patent for a bonding apparatus and a method of controlling the same. This invention includes a bonding head, a wafer chuck configured to receive a wafer, and at least one bonding stage cover disposed above the wafer chuck. This technology aims to improve the efficiency and effectiveness of bonding processes.
Career Highlights
Kang is currently employed at Hanwha Precision Machinery Co., Ltd., where he continues to develop and refine technologies related to bonding apparatuses. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.
Collaborations
Tae Woo Kang has collaborated with talented individuals such as Ji Hwan Bae and Yong Hyun Lee. These partnerships have fostered innovation and contributed to the advancement of bonding technologies.
Conclusion
Tae Woo Kang's contributions to bonding technology through his patent and work at Hanwha Precision Machinery Co., Ltd. highlight his role as an influential inventor in the field. His innovative spirit continues to drive advancements in manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile