The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Aug. 17, 2022
Hanwha Precision Machinery Co., Ltd., Changwon-si, KR;
Tae Woo Kang, Changwon-si, KR;
Ho Joon Shin, Changwon-si, KR;
HANWHA PRECISION MACHINERY CO., LTD., Changwon-si, KR;
Abstract
Provided is a bonding apparatus including a first wafer supplier including a plurality of load ports configured to store wafers having different sizes, the wafers including a plurality of substrate wafers and a plurality of die supply wafers, a first transferer adjacent to the first wafer supplier and configured to transfer the wafers, a first bonding device and a second bonding device facing the first wafer supplier, and configured to receive the wafers from the first wafer supplier and perform bonding, and a first cleaner comprising a plurality of cleaning areas, each of which is configured to receive the plurality of substrate wafers and the plurality of die supply wafers by the first transferer, and clean the plurality of substrate wafers and the plurality of die supply wafers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile