The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Aug. 16, 2022
Applicant:
Hanwha Precision Machinery Co., Ltd., Changwon-si, KR;
Inventors:
Assignee:
HANWHA PRECISION MACHINERY CO., LTD., Changwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/74 (2013.01); H01L 24/80 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80908 (2013.01);
Abstract
Provided are a bonding apparatus and a method of controlling the bonding apparatus. The bonding apparatus includes a bonding head, a wafer chuck configured to receive a wafer thereon, and at least one bonding stage cover disposed above the wafer chuck.