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Anyang-si, South Korea

Tae-Joo Hwang

USPTO Granted Patents = 11

Average Co-Inventor Count = 2.4

ph-index = 3

Forward Citations = 63(Granted Patents)

Location History:

Gyeonggi-do, KR (2009 - 2010)
Anyang-si, KR (2011 - 2017)

Company Filing History:

11 out of 131,214

Samsung Electronics Co., Ltd.

Years Active: 2009-2017

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9685400 - Semiconductor package and method of forming the same (2017-06-20),

2. 9484292 - Semiconductor package and method of forming the same (2016-11-01),

3. 8736035 - Semiconductor package and method of forming the same (2014-05-27),

4. 8723315 - Flip chip package (2014-05-13),

5. 8421244 - Semiconductor package and method of forming the same (2013-04-16),

6. 8178969 - Flip chip package (2012-05-15),

7. 8129221 - Semiconductor package and method of forming the same (2012-03-06),

8. 8022555 - Semiconductor package and method of forming the same (2011-09-20),

9. 7821139 - Flip-chip assembly and method of manufacturing the same (2010-10-26),

10. 7612450 - Semiconductor package including dummy board and method of fabricating the same (2009-11-03),

11. 7560374 - Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold (2009-07-14),

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