Samsung Electronics Co., Ltd.

Tae-Joo Hwang

Eun-Chul Ahn

Tae-Gyeong Chung

Cha-Jea Jo

Jong-joo Lee

Jong-Gi Lee

A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal.

Semiconductor package and method of forming the same

A flip chip package may include a substrate, a semiconductor chip, main bump structures and auxiliary bump structures. The substrate has a circuit pattern. The semiconductor chip is arranged over the substrate. The semiconductor chip includes a body having semiconductor structures, main pads electrically connected to the semiconductor structures to mainly control the semiconductor structures, and auxiliary pads electrically connected to the semiconductor structures to provide auxiliary control of the semiconductor structures. The main bump structures are interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the main pads. The auxiliary bump structures can be interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the auxiliary pads.

Flip chip package

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.

A flip-chip assembly comprises a semiconductor chip, a substrate, a first buffer layer, a second buffer layer and a conductive bump. The semiconductor chip includes a first region and a second region adjacent to the first region. The substrate is disposed under the semiconductor chip. The first buffer layer is disposed between the first region of the semiconductor chip and the substrate. The second buffer layer is disposed between the second region of the semiconductor chip and the substrate. The conductive bump is formed through the second buffer layer and electrically connects the semiconductor chip to the substrate.

Flip-chip assembly and method of manufacturing the same

Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip, and a plurality of conductive balls, e.g., solder balls formed on a joint surface of the semiconductor chip. A dummy board includes openings aligned with the solder balls and is bonded to the joint surface of the semiconductor chip. An adhesive material is interposed between the semiconductor chip and the dummy board to adhere the dummy board to the semiconductor chip. The adhesive material is applied on an adhesion surface of the dummy board adhered to a joint surface of the semiconductor chip. The dummy board is adhered to the joint surface of the semiconductor chip such that the solder balls are aligned with the openings. Cheap underfill materials can be selectively used, and a process time for reflow and curing of the adhesive material can be greatly reduced.

Semiconductor package including dummy board and method of fabricating the same

A mold for forming a conductive bump, a method of fabricating the mold, and a method of forming a bump on a wafer using the mold are provided. The bump can be formed by employing various materials, the mold can be repeatedly used several times because the mold is not damaged, and due to a high precision, the pitch of the bumps is not limited. The mold for forming a conductive bump comprises a first substrate having a groove to form a bump; a second substrate for vacuum adsorption formed below the first substrate, and having a through-hole in communication with the groove; and a mask layer formed on the first substrate, and used to form the groove.

Growing community of inventors

Anyang-si, South Korea

Tae-Joo Hwang