Location History:
- Kyunggi-do, KR (2002)
- Kuri-shi, KR (2003 - 2008)
Company Filing History:
Years Active: 2002-2008
Title: Innovations by Tae Heon Lee in Semiconductor Technology
Introduction
Tae Heon Lee is a prominent inventor based in Kuri-shi, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on enhancing the efficiency and design of semiconductor packages.
Latest Patents
One of Tae Heon Lee's latest patents is a semiconductor package having reduced thickness. This innovative design includes a chip paddle and a semiconductor chip equipped with multiple bond pads. The semiconductor chip is positioned on the upper surface of the chip paddle, with leads formed at intervals along the perimeter. These leads are in electrical communication with the bond pads. The entire assembly, including the semiconductor chip, chip paddle, and leads, is encapsulated by an encapsulation material. A key feature of this invention is the minimized height of the semiconductor package, achieved by half etching the chip paddle to reduce its thickness. The thickness of the chip paddle is designed to be less than that of the leads, ideally ranging from 25% to 75% of the lead thickness.
Career Highlights
Tae Heon Lee is currently employed at Amkor Technology, Inc., where he continues to innovate in semiconductor packaging. His expertise and contributions have positioned him as a valuable asset in the industry.
Collaborations
Throughout his career, Tae Heon Lee has collaborated with notable colleagues, including Mu Hwan Seo and Young Suk Chung. These partnerships have fostered a collaborative environment that enhances the development of cutting-edge technologies.
Conclusion
Tae Heon Lee's work in semiconductor technology exemplifies innovation and dedication to improving electronic components. His patents reflect a commitment to advancing the field and addressing the challenges of modern technology.