Method for making a semiconductor package having improved defect testing and increased production yield

Abstract

A method for making a packaged semiconductor having improved defect testing and increased production yield. The method includes providing a plurality of unit leadframes in a matrix, wherein each of the leadframes comprises a die pad connected to the leadframes by a plurality of tie bars, a plurality of tabs extending from each of the unit leadframes towards the respective die pad without contacting the die pad, and a plurality of dam bars provided on a boundary of the tabs. Next a semiconductor chip having a plurality of bond pads is mounted to a first surface of the die pad in each of said unit leadframes via an adhesive. The bond wires between each of the plurality of die pads are electrically connected to the respective semiconductor chip in each of the plurality of unit leadframes. Each of the unit leadframes is then encapsulated with an encapsulant. Each of the unit semiconductor packages is singulated from the matrix by cutting said dam bars between the tabs in each of the unit leadframes on two X-axes simultaneously, while leaving a connection between the tie bars and the unit leadframes intact. Then, each of the unit semiconductor packages are cut at the dam bars between the tabs on two Y-axes simultaneously, while leaving a connection between the tie bars and the unit leadframes intact. The entire matrix is next tested. Finally, the tie bars in each unit semiconductor package is cut to separate the semiconductor packages from the matrix.