Company Filing History:
Years Active: 2002-2008
Title: Mu Hwan Seo: Innovator in Semiconductor Technology
Introduction
Mu Hwan Seo is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. He holds a total of 6 patents, showcasing his innovative approach to enhancing semiconductor packaging.
Latest Patents
One of his latest patents is a semiconductor package having reduced thickness. This invention comprises a chip paddle and a semiconductor chip that features a plurality of bond pads. The semiconductor chip is positioned on the upper surface of the chip paddle, with leads formed at intervals along the perimeter. These leads are in electrical communication with the bond pads. The entire assembly, including the semiconductor chip, chip paddle, and leads, is encapsulated by an encapsulation material. Notably, the height of the semiconductor package is minimized by half etching the chip paddle, reducing its thickness to less than that of the leads. The chip paddle's thickness is ideally about 25-75% of the thickness of the leads.
Career Highlights
Mu Hwan Seo is currently employed at Amkor Technology, Inc., where he continues to develop innovative solutions in semiconductor packaging. His work has significantly impacted the efficiency and performance of semiconductor devices.
Collaborations
Throughout his career, Mu Hwan Seo has collaborated with notable colleagues, including Tae Heon Lee and Young Suk Chung. These partnerships have fostered a creative environment that encourages innovation and technological advancement.
Conclusion
Mu Hwan Seo's contributions to semiconductor technology exemplify the spirit of innovation. His patents reflect a commitment to improving the efficiency and functionality of semiconductor packages.