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Daejeon, South Korea

Tae Gon Lee

USPTO Granted Patents = 3 (Patent Applications = 1)

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 7(Granted Patents)

Location History:

Kyunggi-do, KR (2008)
Daejeon, KR (2010 - 2012)

Company Filing History:

Samsung Electro-mechanics Co., Ltd.

Years Active: 2008-2012

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8236690 - Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad (2012-08-07),

2. 7768116 - Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same (2010-08-03),

3. 7414317 - BGA package with concave shaped bonding pads (2008-08-19),

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