The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Jun. 22, 2010
Kyoung RO Yoon, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Yoon Su Kim, Gangwon-do, KR;
Tae Gon Lee, Daejeon, KR;
Kyoung Ro Yoon, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Yoon Su Kim, Gangwon-do, KR;
Tae Gon Lee, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method for fabricating a semiconductor package substrate, including: preparing a copper clad laminate and half etching a copper foil on a wire bonding pad side of the copper clad laminate; depositing a first etching resist on the opposite sides of the copper clad laminate; forming circuit patterns on the first etching resist, constructing circuits including a wire bonding pad and a ball pad after the model of the circuit patterns, and removing the first etching resist; applying a solder resist to the copper clad laminate in such a way to expose the wire bonding pad and the ball pad; and plating the wire bonding pad with gold and subjecting the ball pad to surface treatment.