The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2008
Filed:
Apr. 13, 2005
Applicants:
Hyo Soo Lee, Daejeon, KR;
Tae Gon Lee, Kyunggi-do, KR;
Sung Eun Park, Daejeon, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Kyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a periphery. With this bent structure of the dish configuration, the bonding pad provides an increased bonding area for the solder, so that the BGA package substrate is enhanced in reliability.