Location History:
- Ibaraki-ken, JP (2003 - 2006)
- Omitama, JP (2011 - 2015)
- Ibaraki, JP (2017)
- Tokyo, JP (2016 - 2022)
Company Filing History:
Years Active: 2003-2022
Title: Tadayoshi Itoh: Innovator in Heat-Shrinkable Multilayer Films
Introduction
Tadayoshi Itoh is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging materials, particularly through his innovative work on heat-shrinkable multilayer films. With a total of 11 patents to his name, Itoh's inventions have had a considerable impact on the industry.
Latest Patents
One of Itoh's latest patents involves a heat-shrinkable multilayer film that includes an outer surface layer made of thermoplastic resin, an intermediate layer of polyamide resin, and an inner surface layer of sealable resin. The total thickness of this film ranges from 95 to 160 micrometers, with specific thicknesses for each layer. This innovative film boasts high strength and excellent flexibility, making it suitable for various packaging applications, including food packaging. Another patent describes a similar heat-shrinkable multilayer film, which is constructed by laminating an inner surface layer, an adhesive layer, and an intermediate layer. This design enhances the film's performance and usability in packaging.
Career Highlights
Throughout his career, Tadayoshi Itoh has worked with notable companies such as Kureha Corporation and Kureha Kagaku Kogyo Kabushiki Kaisha. His experience in these organizations has allowed him to refine his expertise in materials science and packaging technology.
Collaborations
Itoh has collaborated with several talented individuals in his field, including Takahisa Ueyama and Hitoshi Ishii. These collaborations have contributed to the advancement of innovative packaging solutions.
Conclusion
Tadayoshi Itoh's work in developing heat-shrinkable multilayer films showcases his dedication to innovation in packaging technology. His patents reflect a commitment to enhancing the functionality and efficiency of packaging materials.