The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Nov. 17, 2008
Applicants:

Seiichi Ibe, Ibaraki, JP;

Tadayoshi Itoh, Ibaraki, JP;

Hitoshi Ishii, Ibaraki, JP;

Inventors:

Seiichi Ibe, Ibaraki, JP;

Tadayoshi Itoh, Ibaraki, JP;

Hitoshi Ishii, Ibaraki, JP;

Assignee:

KUREHA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); C08G 69/40 (2006.01); C08L 77/00 (2006.01); C08L 77/06 (2006.01); B65D 75/00 (2006.01); B65D 85/76 (2006.01); B29K 77/00 (2006.01); B29C 51/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); C08G 69/40 (2013.01); C08L 77/00 (2013.01); C08L 77/06 (2013.01); B29C 51/002 (2013.01); B29K 2077/00 (2013.01); B32B 2307/724 (2013.01); B32B 2439/70 (2013.01); B65D 75/002 (2013.01); B65D 85/76 (2013.01); C08L 2205/02 (2013.01); Y10T 428/1328 (2015.01); Y10T 428/264 (2015.01); Y10T 428/31725 (2015.04); Y10T 428/31736 (2015.04);
Abstract

The invention has for its object to provide a heat-shrinkable laminated film for deep drawing, which has an increased carbon dioxide transmission rate (COTR) and an enhanced ratio (COTR/OTR) of carbon dioxide transmission rate-to-oxygen transmission rate (OTR), and is less susceptible to pinholes. In the inventive heat-shrinkable laminated film for deep drawing, a polyamide resin composition layer (a) containing a polyamide resin mixture comprising 60 to 95% by mass of an aliphatic polyamide resin (A) and 5 to 40% by mass of a polyamide base resin (B) having a heat of crystalline fusion of 5 to 40 J/g is laminated onto a heat-sealing resin layer (a) containing a polyolefin resin via an adhesive resin layer (b).


Find Patent Forward Citations

Loading…