The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Oct. 18, 2017
Kureha Corporation, Tokyo, JP;
KUREHA CORPORATION, Tokyo, JP;
Abstract
Provided is a heat-shrinkable multilayer film including: an outer surface layer including a thermoplastic resin; an intermediate layer including a polyamide resin; and an inner surface layer including a sealable resin; the total thickness of the heat-shrinkable multilayer film being from 95 to 160 μm; the thickness of the intermediate layer including the polyamide resin being from 17 to 47 μm; the thickness of the inner surface layer being 55 μm or greater; and the ratio of the thickness of the intermediate layer including the polyamide resin to the total thickness of the heat-shrinkable multilayer film being from 18 to 29%. The heat-shrinkable multilayer film of the present invention has high strength and excellent flexibility. Therefore, the heat-shrinkable multilayer film of the present invention is easily stretched and formed, and can be suitably used as a variety of packaging materials including a food packaging material.