Company Filing History:
1 out of 105 
1 out of 4,979 
1 out of 1 
Years Active: 2009
Title: Tadatomo Suga: Innovator in Metal Bonding Technology
Introduction
Tadatomo Suga is a notable inventor based in Hongo, Bunkyo-ku, Tokyo, Japan. He has made significant contributions to the field of bonding technologies, particularly through his innovative patent that simplifies the bonding process of metal to substrates. His work has implications for various industries, enhancing efficiency and reducing costs.
Latest Patents
Tadatomo Suga holds a patent for a "Device for bonding a metal on a surface of a substrate." This invention involves a device and method for bonding objects that have metal bonding portions on a substrate. The process includes cleaning means that expose the metal bonding portions to a plasma, etching the surfaces at a depth of 1.6 nm or more. This is done under reduced pressure, followed by bonding means that allow for the bonding of these portions in atmospheric air. This innovative approach significantly simplifies the bonding process and reduces overall costs.
Career Highlights
Throughout his career, Tadatomo Suga has worked with various companies, including Toray Engineering Company, Limited. His expertise in bonding technologies has positioned him as a key figure in the development of efficient manufacturing processes.
Collaborations
Tadatomo Suga has collaborated with notable individuals in his field, including Toshihiro Ito and Akira Yamauchi. These collaborations have contributed to the advancement of bonding technologies and have fostered innovation in the industry.
Conclusion
Tadatomo Suga's contributions to metal bonding technology exemplify the impact of innovative thinking in engineering. His patent not only simplifies the bonding process but also offers a cost-effective solution for various applications. His work continues to influence the field and inspire future innovations.