The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Sep. 22, 2003
Tadatomo Suga, Hongo, Bunkyo-ku, Tokyo, 113-8656, JP;
Toshihiro Ito, Tokyo, JP;
Akira Yamauchi, Shiga, JP;
Tadatomo Suga, Hongo, Bunkyo-ku, Tokyo, 113-8656, JP;
Toshihiro Ito, Tokyo, JP;
Akira Yamauchi, Shiga, JP;
Other;
Toray Engineering Co., Ltd., Osaka, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Sanyo Electric Industry Co., Ltd., Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Sony Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Fujitsu Limited, Kanagawa, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Rohm Co., Ltd., Kyoto, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surfaces of the metal bonding portions at a depth of 1.6 nm or more over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in an atmospheric air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the atmospheric air, thereby significantly simplifying the bonding process and the whole device and lowering the cost.