Saitama, Japan

Tadashi Yamaguchi

This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignees: Nippon Micrometal Corporation, Nippon Steel Chemical & Material Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tadashi Yamaguchi. Retrieved from https://idiyas.com/inventor/tadashi-yamaguchi-jrmfa0go

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Tadashi Yamaguchi

Introduction

Tadashi Yamaguchi is a notable inventor based in Saitama, Japan. He is recognized for his contributions to the field of materials science, particularly in the development of bonding wires. His innovative work has led to advancements that enhance the performance and reliability of electronic components.

Latest Patents

One of Yamaguchi's significant patents is for a copper bonding wire. This invention provides a solution that exhibits favorable bondability even when the scrub during bonding is reduced. The copper bonding wire is characterized by a specific ratio of CuO and Cu(OH) on its surface, which is crucial for its performance. The patent highlights that the ratio of bivalent Cu to monovalent Cu falls within a range from 0.8 to 12, ensuring optimal bonding characteristics.

Career Highlights

Throughout his career, Yamaguchi has worked with prominent companies in the industry. He has been associated with Nippon Micrometal Corporation and Nippon Steel Chemical & Material Co., Ltd. His experience in these organizations has contributed to his expertise in materials and bonding technologies.

Collaborations

Yamaguchi has collaborated with several professionals in his field, including Tomohiro Uno and Tetsuya Oyamada. These collaborations have fostered innovation and have been instrumental in advancing the technology related to bonding wires.

Conclusion

Tadashi Yamaguchi's contributions to the field of materials science, particularly through his patent for copper bonding wire, demonstrate his innovative spirit and commitment to enhancing electronic component reliability. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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