Susumu Yokoo

Title: Susumu Yokoo: Innovator in Wafer Processing Technology

Introduction

Susumu Yokoo is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing, holding a total of 6 patents. His innovative methods have advanced the technology used in semiconductor manufacturing.

Latest Patents

Yokoo's latest patents include a wafer processing method that involves several key steps. The process begins with a resin film coating step, where a water-soluble resin is applied to the upper surface of a wafer and a dicing tape. This is followed by a partial resin film removing step, which exposes regions of the wafer for further processing. The etching step involves plasma etching to divide the wafer into individual device chips. Finally, a whole resin film removing step cleans the frame unit by removing the resin film entirely. Another notable patent is a processing method of a wafer that includes preparing a frame unit, holding the wafer in an etching chamber, and executing dry etching after shielding the annular frame from external influences.

Career Highlights

Yokoo is currently employed at Disco Corporation, where he continues to develop innovative solutions in wafer processing technology. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Throughout his career, Yokoo has collaborated with notable colleagues, including Hiroyuki Takahashi and Yoshiteru Nishida. These collaborations have fostered a creative environment that has led to significant advancements in their field.

Conclusion

Susumu Yokoo's contributions to wafer processing technology exemplify the spirit of innovation. His patents and work at Disco Corporation highlight his commitment to advancing semiconductor manufacturing. His achievements continue to influence the industry and inspire future inventors.