The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Jul. 16, 2020
Disco Corporation, Tokyo, JP;
Hiroyuki Takahashi, Tokyo, JP;
Kentaro Wada, Tokyo, JP;
Yoshio Watanabe, Tokyo, JP;
Susumu Yokoo, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
There is provided a processing method of a wafer. The processing method includes a frame unit preparation step of fixing the wafer in an opening of an annular frame by an adhesion tape to prepare a frame unit and a frame unit holding step of attracting and holding the wafer of the frame unit by an chuck table in an etching chamber with the intermediary of the adhesion tape. The processing method includes also a shielding step of covering the annular frame and (or) an annular region of the adhesion tape by a cover member to shield the annular frame and (or) the annular region from an external space and a dry etching step of supplying a gas to the etching chamber and executing dry etching for the wafer after execution of the frame unit holding step and the shielding step.