Susumu Yakoo

Title: Susumu Yakoo: Innovator in Wafer Processing Technology

Introduction

Susumu Yakoo is a prominent inventor based in Tokyo, Japan. He is known for his significant contributions to the field of wafer processing technology. With a focus on enhancing the efficiency and precision of semiconductor manufacturing, Yakoo has made a notable impact in the industry.

Latest Patents

Yakoo holds a patent for a wafer processing method. This innovative method involves forming a resist film on the front side of a wafer, excluding division lines. The process includes plasma etching to create grooves along each division line, which have a depth greater than the finished thickness. After cleaning, the resist film is removed, and the back side of the wafer is ground to achieve the desired thickness. This method ensures that the grooves are exposed on the back side, allowing for the division of the wafer into individual device chips. The resist film removal step utilizes a chemical fluid to effectively clean the surface.

Career Highlights

Yakoo is associated with Disco Corporation, a company renowned for its advancements in semiconductor manufacturing equipment. His work at Disco Corporation has positioned him as a key player in the development of innovative wafer processing techniques.

Collaborations

Yakoo has collaborated with notable colleagues, including Tomotaka Tabuchi and Kenji Okazaki. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Susumu Yakoo's contributions to wafer processing technology exemplify his dedication to advancing the semiconductor industry. His innovative methods and collaborations with esteemed colleagues highlight his role as a leading inventor in this field.