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For the Inventor, By the Inventor

Annaka, Japan

Susumu Kuwabara

This inventor holds 13 USPTO granted patents and 3 published patent applications and 8 EPO patents. Top assignees: Shin-Etsu Handotai Co., Ltd., Unity Semiconductor Corporation, Other. Active years: 1994-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Susumu Kuwabara. Retrieved from https://idiyas.com/inventor/susumu-kuwabara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.7

ph-index = 4

Forward Citations = 108(Granted Patents)


Location History:

  • Gunma, JP (2003 - 2007)
  • Annaka, JP (1994 - 2024)

Company Filing History:

goldMedal11 out of 1,099 
 
Shin-Etsu Handotai Co., Ltd.
 patents
silverMedal1 out of 301 
 
Unity Semiconductor Corporation
 patents
bronzeMedal2 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1994-2024

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13 patents (USPTO):Explore Patents
1. 11965730 - Method for measuring film thickness distribution of wafer with thin films (2024-04-23),
2. 10115580 - Method for manufacturing an SOI wafer (2018-10-30),
3. 9279665 - Method for measuring film thickness distribution (2016-03-08),
4. 8981291 - Method for measuring film thickness of SOI layer of SOI wafer (2015-03-17),
5. 8976369 - Method for evaluating thin-film-formed wafer (2015-03-10),
6. 8741741 - Method for designing SOI wafer and method for manufacturing SOI wafer (2014-06-03),
7. 8497187 - Method for manufacturing SOI wafer and SOI wafer (2013-07-30),
8. 8311771 - Inspection method of SOI wafer (2012-11-13),
9. 7176102 - Method for producing SOI wafer and SOI wafer (2007-02-13),
10. 6846718 - Method for producing SOI wafer and SOI wafer (2005-01-25),
11. 6720640 - Method for reclaiming delaminated wafer and reclaimed delaminated wafer (2004-04-13),
12. 6596610 - Method for reclaiming delaminated wafer and reclaimed delaminated wafer (2003-07-22),
13. 5321264 - Method for evaluating surface state of silicon wafer (1994-06-14),

Title: The Innovative Contributions of Susumu Kuwabara

Introduction

Susumu Kuwabara is a notable inventor based in Annaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work primarily focuses on methods for measuring film thickness distribution and manufacturing silicon-on-insulator (SOI) wafers.

Latest Patents

Kuwabara's latest patents include a method for measuring film thickness distribution of wafers with thin films. This method involves determining the height of focus using an optical microscope with an autofocus function, calculating the standard deviation of reflected-light intensity distribution, and correcting the autofocus function to obtain accurate observation images. Another significant patent is a method for manufacturing an SOI wafer, which includes a thinning step to adjust the SOI film thickness. This method ensures excellent radial film thickness uniformity after the thinning process.

Career Highlights

Throughout his career, Kuwabara has worked with prominent companies, including Shin-etsu Handotai Co., Ltd. His expertise in semiconductor technology has made him a valuable asset in the industry.

Collaborations

Kuwabara has collaborated with notable individuals such as Kiyoshi Mitani and Naoto Tate, contributing to advancements in semiconductor manufacturing techniques.

Conclusion

Susumu Kuwabara's innovative methods and patents have significantly impacted the semiconductor industry. His dedication to improving wafer manufacturing processes continues to influence the field today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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