Tokyo, Japan

Susumu Akiyama


Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2004-2018

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Susumu Akiyama

Introduction

Susumu Akiyama is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, particularly in the area of sputtering apparatus and substrate processing. With a total of six patents to his name, Akiyama's work has had a considerable impact on various industries.

Latest Patents

Akiyama's latest patents include a reactive sputtering apparatus and a substrate processing apparatus. The reactive sputtering apparatus features a chamber with a substrate holder and a target holder, designed to create a sputtering space that prevents particles from adhering to the chamber's inner walls. It also includes a reactive gas introduction pipe and an inert gas introduction port to facilitate the sputtering process. The substrate processing apparatus consists of a process chamber with a substrate holder and two shields that partition the internal space into an outer space and a process space. This design allows for efficient substrate processing while maintaining a consistent gap between the shields.

Career Highlights

Throughout his career, Akiyama has worked with notable companies such as Canon Anelva Corporation and Anelva Corporation. His experience in these organizations has contributed to his expertise in developing advanced technologies related to sputtering and substrate processing.

Collaborations

Akiyama has collaborated with esteemed colleagues, including Nobuo Yamaguchi and Kazuaki Matsuo. Their combined efforts have furthered the development of innovative technologies in their respective fields.

Conclusion

Susumu Akiyama's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in sputtering and substrate processing technologies.

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