The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Apr. 01, 2015
Applicant:

Canon Anelva Corporation, Kawasaki-shi, JP;

Inventors:

Nobuo Yamaguchi, Tama, JP;

Kazuaki Matsuo, Inagi, JP;

Susumu Akiyama, Tokyo, JP;

Satoshi Uchino, Fuchu, JP;

Yoshimitsu Shimane, Hachioji, JP;

Assignee:

CANON ANELVA CORPORATION, Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); C23C 14/0063 (2013.01); C23C 14/0068 (2013.01); H01J 37/3405 (2013.01); H01J 37/3411 (2013.01); H01J 37/3441 (2013.01); H01J 37/3447 (2013.01); H01J 2237/3328 (2013.01);
Abstract

A reactive sputtering apparatus includes a chamber, a substrate holder provided in the chamber, a target holder which is provided in the chamber and configured to hold a target, a deposition shield plate which is provided in the chamber so as to form a sputtering space between the target holder and the substrate holder, and prevents a sputter particle from adhering to an inner wall of the chamber, a reactive gas introduction pipe configured to introduce a reactive gas into the sputtering space, an inert gas introduction port which introduces an inert gas into a space that falls outside the sputtering space and within the chamber, and a shielding member which prevents a sputter particle from the target mounted on the target holder from adhering to an introduction port of the reactive gas introduction pipe upon sputtering.


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