Susrut Kesari is a prominent inventor based in Santa Clara, CA (US). He has made significant contributions to the field of electrochemical and chemical deposition technologies. With a total of 5 patents to his name, Kesari has established himself as a key figure in innovation.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor." This invention provides innovative plating solutions that utilize either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides. These solutions are designed for the effective electrochemical or chemical deposition of copper interconnects. Another notable patent is "Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor." This invention outlines methods for polishing and cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.

Career Highlights

Susrut Kesari is currently associated with 3M Innovative Properties Company, where he continues to drive innovation in his field. His work has been instrumental in advancing technologies related to copper interconnects, which are crucial for modern electronic devices.

Collaborations

Throughout his career, Kesari has collaborated with notable colleagues, including Michael J Parent and William M Lamanna. These collaborations have further enhanced the impact of his inventions and research.

Conclusion

Susrut Kesari's contributions to the field of electrochemical deposition and copper interconnect technology are noteworthy. His innovative patents and ongoing work at 3M Innovative Properties Company highlight his role as a leading inventor in this critical area of technology.

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