Sungyun Woo

Title: The Innovative Contributions of Sungyun Woo

Introduction

Sungyun Woo is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology. His work primarily focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

Sungyun Woo holds a patent for "Semiconductor packages having test pads." This innovative semiconductor package includes a base chip with a front surface and a back surface. The base chip features bump pads, wafer test pads, and package test pads on the front surface. Additionally, connection structures are disposed on the front surface of the base chip and are connected to the bump pads. Semiconductor chips are stacked on the back surface of the base chip, with each wafer test pad being smaller than the package test pads. This design aims to improve the testing and performance of semiconductor devices.

Career Highlights

Sungyun Woo is currently employed at Samsung Electronics Ltd., a leading company in the technology sector. His work at Samsung has allowed him to be at the forefront of semiconductor innovation. With a total of 1 patent, he continues to contribute to advancements in this critical field.

Collaborations

Sungyun Woo collaborates with talented colleagues, including Jongmin Lee and Joongwon Shin. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Sungyun Woo's contributions to semiconductor technology exemplify the importance of innovation in the tech industry. His patent for semiconductor packages demonstrates his commitment to enhancing device performance. Through his work at Samsung Electronics Ltd., he continues to influence the future of technology.